multipass welding

The aim of the paper is to investigate one of the causes of ductility-dip cracks (DDC) formation. The main aim of this work is calculation of grain boundaries (GB) cohesive energy in nickel based In52 and In52 MSS alloys. For measuring the GB energy anisotropy methods of thermal etching and light interferometry were used. DDC form on the grain boundaries of nickel based alloys due to adsorption of impurities during multipass welding. The In52 alloy has tendency to form DDC during multipass welding fusion unlike In52 MSS one doped with Mo and Nb.