solder burden

Mechanisms of structural-phase transformations during crystallization of a solder melt

Problem statement. An important requirement is quality assurance of joining materials with minimal overheating of materials, lowering the soldering temperature and suppressing the interaction of the solder with the materials to be soldered. The heating of the solder and the holder should be as uniform as possible and with a minimum temperature difference along the depth. One solution may be to develop more efficient solders and fluxes, adapted to the high heating rates that are typical when using high frequency currents Purpose.