Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface
In this paper, the derivation of hyper-singular integral equations (HSIEs) for thermoelectric bonded materials (TEBM) featuring a crack parallel to interface subject to in-plane shear stress $\tau^\infty_{xy}$ was intensively studied. Generally, stress intensity factors (SIFs) were calculated using HSIEs with the help of modified complex stress variable function (MCSVF), and continuity conditions of the resultant electric force and displacement electric function. The unknown crack opening displacement (COD) function, electric current density, and energy flux load are