High Density Highperformance Computing Systems Cooling

2018;
: pp.112-124
1
Lviv Polytechnic National University, The John Paul II Catholic University of Lublin
2
Hewlett Packard Enterprise

The paper deals with the cooling approaches and aims at using solutions for the energy efficient and economically viable high density computing system construction and usage. Power consumption of the standalone high density computing systems and supercomputing clusters with different types of cooling has been considered and their characteristics have been estimated. The influence on the overall budget of the system construction and exploitation for 5 years of life time has been analyzed.

[1] Golovinsky A. L., Malenko A. L., Modern methods of coo-ling supercomputer centers, Glushkov Institute of Cyber-netics, National Academy of Sciences of Ukraine, 2014

[2] HPE ProLiant Gen10 Server Extended Ambient Temperature Guidelines. Hewlett Packard Enterprise. 2017, 2018.

[3] HPE Power Advisor Tool. Hewlett Packard Enterprise. https://paonline56.itcs.hpe.com/ .

[4] Data Center Liquid Cooling — Global Market Outlook (2017–2023). StatisticsMRC, January 2018. ID code: SMRC16949.

[5] ASHRAE TC9.9, Thermal Guidelines for Data Processing Environments, Fourth Edition, ASHRAE, Atlanta Georgia, 2015.

[6] Salimifard, Parichehr. (2014). Comparison of part load model prediction of commercial office subsystem energy consumption with sub-metered data. 10.13140/2.1.1033.2963.

[7] High Temperature Electronics. F. Patrick McCluskey, Thomas Podlesak, Richard Grzybowski. CRC Press, 1997.

[8] Vysokie toki utechki. NVIDIA GeForce GTX 480 (GF100)", https://overclockers.ru/blog/RussOver/show/ 14701/Vysokie_toki_utechki_NVIDIA_GeForce_GTX_480_GF100

[9] MaxxAir IF18 3000-CFM 18-Inch Blade Heavy-Duty Exhaust Fan Specification. http://www.maxxair.com/ products/maxxfan/maxxfan.php#

[10] James R. Welty; Charles E. Wicks; Robert E. Wilson; Gregory L. Rorrer (2007). Fundamentals of Momentum, Heat and Mass transfer (5th edition). John Wiley and Sons. ISBN 978-0470128688.

[11] Heat Transfer Coefficient. https://en.wikipedia.org/ wiki/Heat_transfer_coefficient

[12] "Average overall heat transmission coefficients for some common fluids and surface combinations as Water to Air, Water to Water, Air to Air, Steam to Water and more". https://www.engineeringtoolbox.com/overall-heat-transfer-coefficients-d_...

[13] Thermodynamics. An engineering approach (7th ed.). Boles, Yunus A. Çengel, Michael A. (2011). New York: McGraw-Hill. p. 608.

[14] 35 kW Active Rectifier with Integrated Power Modules. Peter Wiedemuth, HÜTTINGER Elektronik GmbH + Co. KG, Germany. Serge Bontemps, Microsemi PPG power module Products, France. Johann Miniböck, m-pec, Austria and ETH Zurich, power electronic systems laboratory, Switzerland.

[15] https://rp5.ru/Weather_in_the_world [16]https://birdinflight.com/ru/infografica/12042016-climate-kiev-100-years....