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The geometric dimensions of the copper shell formed by chemical deposition on a spherical polyethylene granule were calculated. It is shown that the main factor determining the thickness of the formed copper layer is the initial size of the polyethylene granule. The processes of destruction of the copper shell formed on the polyethylene granule during thermal expansion of the polymer are considered. The values of the limit temperatures in which the copper shell still retains its integrity depending on its thickness are calculated.

The results of experimental studies of copper plating of polyvinyl chloride granules in a chemical precipitation solution are presented. The influence of the surface area of polyvinyl chloride granules on the kinetic regularities of copper reduction and the copper content on metallized granules has been studied. It is established that the surface area of polyvinyl chloride granules has a significant effect on the rate of reduction of copper ions and does not affect the amount of reduced copper.