silicon

CHROME PLATING OF PRESS TOOLING USED IN THE PRODUCTION OF NEW ELASTOMERIC MATERIALS

This research has produced multicomponent titanium-doped chromium coatings to strengthen the working surfaces of press tooling dies operated under aggressive conditions during the vulcanization of products from new elastomeric materials. The pressing was carried out on a hydraulic vulcanization press 100-400 2E.

GRAPHENE – GOLD GRATING-BASED STRUCTURE TO ACHIEVE ENHANCED ELECTROMAGNETIC FIELD DISTRIBUTION

In this work, the field distribution in structures such as a gold grating, a graphene layer, and a silicon substrate was studied. The conditions for maximum electromagnetic field distribution (absorption) by this structure to use in photonics and electronics devices were established. The magnitude of the electromagnetic field of a gold diffraction grating with a graphene layer increases with decreasing slit width. At the same time, an increase in the period leads to small changes in the electromagnetic field distribution.

Modification of Silicon Surface with Silver, Gold and Palladium Nanostructures via Galvanic Substitution in DMSO and DMF Solutions

The investigation results of silver, palladium and gold nanoscale particles deposition on the silicon surface in the DMSO and DMF media are presented. The influence of organic aprotic solvents on the geometry of metal particles and their distribution on the substrate is described. It is shown that solutions of stable metal complexes ([Ag (CN)2] – , [AuCl4] – ) are the main factor in the formation of discrete nanoparticles with a small range of sizes and uniform distribution along the substrate surface, as well as nanostructured films.

Physical Topological Aspects of Modeling Gallium Arsenide Super Beta Transistor for Speed Lic Ofcomputer Systems

Among the semiconductors in latitude use in microelectronics for digital circuits silicon has been and remains the main material. However, today began intensively implemented circuits based on gallium arsenide. Gallium arsenide circuits because of the high charge carrier mobility in GaAs with a frequency range of operation of reach for chips based on silicon (Si).