Cross-linking of epoxy-oligomeric mixtures based on ED-20 industrial epoxy dianic resin and TGM-3 oligoesteracrylate in the presence of fluorine-containing peroxy oligomers has been studied. Oligomers used for the cross-linking have been obtained via chemical modification of peroxy derivative of ED-24 epoxy resin with alcohols-telomers by general formula HOCH2–(CF2–CF2)nH, where n is 3 or 4. The thermal stability of peroxy groups in the initial material, fluorine-containing peroxy oligomers and stability of cross-linked films have been examined using derivatographic methods. The effect of temperature, process time and mixture composition on the gel-fraction content and hardness of obtained films has been established.
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